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Compressive Behavior of Pyramidal, Tetrahedral, and Strut‐Reinforced Tetrahedral ABS and Electroplated Cellular Solids
Author(s) -
Markkula Samuel,
Storck Steven,
Burns Devin,
Zupan Marc
Publication year - 2009
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200800284
Subject(s) - tetrahedron , materials science , electroplating , network topology , deposition (geology) , composite material , topology (electrical circuits) , nanotechnology , crystallography , computer science , engineering , electrical engineering , paleontology , chemistry , layer (electronics) , sediment , biology , operating system
Fused deposition modeling combined with electroplating provides a novel manufacturing methodology for building low relative density engineered cellular topologies. Here the mechanical performance of tetrahedral, pyramidal, and strut‐reinforced tetrahedral cellular solids manufactured from multiphase nickel‐copper‐ABS is studied. The novel processing and geometric optimization places these engineered topologies into an unoccupied location in the material universe.