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Strain Hardening Behavior of Ultrafine‐ Grained Cu by Analyzing the Tensile Stress‐Strain Curve
Author(s) -
Huang C.X.,
Wu S.D.,
Li S.X.,
Zhang Z.F.
Publication year - 2008
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200700324
Subject(s) - materials science , strain hardening exponent , hardening (computing) , metallurgy , composite material , ultimate tensile strength , plasticity , strain (injury) , medicine , layer (electronics)
UFG Cu was found to experience two stages of strain hardening processes under uniaxial tensile stress, which was similar to the Stage IV and V of CG Cu after large plastic deformation. The storage of dislocations in small grains and dynamic recovery caused by annihilation of dislocations and GB‐mediated processes were responsible for the different stages of strain hardening behavior. Improvement of strain hardening capability for UFG metals should be based on the mechanisms of strain hardening.