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Bonding Low‐density Nanoporous Metal Foams Using Sputtered Solder
Author(s) -
Bono M. J.,
Cervantes O.,
Akaba C. M.,
Hamza A. V.,
Foreman R. J.,
Teslich N. E.
Publication year - 2008
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200700239
Subject(s) - materials science , soldering , nanoporous , copper , substrate (aquarium) , composite material , layer (electronics) , aluminium , metallurgy , metal , metallic bonding , nanotechnology , oceanography , geology
A method has been developed to bond low‐density nanoporous copper foam components to an aluminum substrate using solder that is sputtered onto the surfaces. After assembling the components together and heating them to melt the solder, they were joined together by a layer of solder with a thickness of less than 2 μm.