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Bulk Nanostructured Cu with High Strength and Good Ductility
Author(s) -
Zhang H.,
Jiang Z.,
Lian J.,
Jiang Q.
Publication year - 2008
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200700237
Subject(s) - materials science , ductility (earth science) , ultimate tensile strength , elongation , strain hardening exponent , work hardening , composite material , grain size , fracture (geology) , strain rate , deformation (meteorology) , metallurgy , microstructure , creep
The tensile properties, deformation and fracture behavior of an electrodeposited Cu with an average grain size of ∼ 90 nm were investigated. Compared with other nanostructured Cu documented in the literature, this material exhibits a combination of high yield strength (356 MPa), good tensile elongation (18.2 %) and ductile fracture features. The persistence of work hardening at large strains and strain rate sensitivity might be responsible for the enhanced ductility.