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Self Formed Cu‐W Functionally Graded Material Produced Via Powder Segregation
Author(s) -
Janković Ilić D.,
Fiscina J.,
Oliver C. G.,
Ilić N.,
Mücklich F.
Publication year - 2007
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200700095
Subject(s) - materials science , microstructure , tungsten , composite material , copper , elastic modulus , metallurgy
Copper – tungsten functionally graded material has been produced by Cu infiltration of a tungsten graded preform which is self formed through segregation effect in a weakly excited bimodal W granular media. Electrical and elastic properties of the final materials are strongly influenced by W microstructural evolution obtained during vibration. The optimal microstructure for electrical properties consists of a highly 3‐D interconnected Cu phase (skeleton type of microstructure), while the graded structure has the highest E‐modulus.