Consolidating and Deforming SiC Nanoceramics Via Dynamic Grain Sliding | Zendy

Peng H. | Zendy; Salamon D. | Zendy; Bill J. | Zendy; Rixecker G. | Zendy; Burghard Z. | Zendy; Aldinger F. | Zendy; Shen Z. | Zendy

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Consolidating and Deforming SiC Nanoceramics Via Dynamic Grain Sliding

Author(s) -

Peng H.,

Salamon D.,

Bill J.,

Rixecker G.,

Burghard Z.,

Aldinger F.,

Shen Z.

Publication year - 2007

Publication title -

advanced engineering materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.938

H-Index - 114

eISSN - 1527-2648

pISSN - 1438-1656

DOI - 10.1002/adem.200600243

Subject(s) - spark plasma sintering , materials science , grain boundary sliding , sintering , grain boundary , grain size , composite material , ceramic , deformation (meteorology) , metallurgy , microstructure

β‐SiC nano‐powder (30 nm) was densified and thereafter deformed in a Spark Plasma Sintering apparatus. High strain rates, ∼ 1x \. 10 –3 /s, were achieved during densification and deformation of the SiC nanoceramics. It was found that dynamic grain sliding, a rapid process that stimulates grain sliding lubricated by a liquid phase but does not activate grain‐boundary migration, is a common mechanism responsible for both processes.

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