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Consolidating and Deforming SiC Nanoceramics Via Dynamic Grain Sliding
Author(s) -
Peng H.,
Salamon D.,
Bill J.,
Rixecker G.,
Burghard Z.,
Aldinger F.,
Shen Z.
Publication year - 2007
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200600243
Subject(s) - spark plasma sintering , materials science , grain boundary sliding , sintering , grain boundary , grain size , composite material , ceramic , deformation (meteorology) , metallurgy , microstructure
β‐SiC nano‐powder (30 nm) was densified and thereafter deformed in a Spark Plasma Sintering apparatus. High strain rates, ∼ 1x \. 10 –3 /s, were achieved during densification and deformation of the SiC nanoceramics. It was found that dynamic grain sliding, a rapid process that stimulates grain sliding lubricated by a liquid phase but does not activate grain‐boundary migration, is a common mechanism responsible for both processes.