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The Effect of Intermetallic Compound on Shear Strength of Diffusion Soldered Interconnection
Author(s) -
Wojewoda J.,
Onderka B.,
Zieba P.
Publication year - 2006
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200500255
Subject(s) - intermetallic , materials science , soldering , interconnection , eutectic system , alloy , scanning electron microscope , metallurgy , diffusion , shear strength (soil) , composite material , shear (geology) , indium , direct shear test , thermodynamics , computer network , physics , environmental science , soil water , computer science , soil science
The mechanical properties of diffusion soldered Cu/Cu interconnections were examined. Application of the indium‐tin eutectic alloy as a solder material and different manufacturing temperatures resulted in creation of the intermetallics in the interconnection area. The calculated cross‐sections of the Cu‐In‐Sn diagram combined with Scanning Electron Microscopy investigation allowed for the detailed description of the joints before the shear test and after it.