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Thermal Oxidation Study on Lead‐free Solders of Sn‐Ag‐Cu and Sn‐Ag‐Cu‐Ge
Author(s) -
Wan Cho S.,
Han K.,
Yi Y.,
Kang S. J.,
Yoo K.H.,
Jeong K.,
Whang C.N.
Publication year - 2006
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200500188
Subject(s) - soldering , materials science , x ray photoelectron spectroscopy , metallurgy , electronic packaging , electronics , lead (geology) , chemical engineering , composite material , chemistry , engineering , geomorphology , geology
At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We report the surface oxidation mechanism of Pb‐free solder in this paper. This mechanism has been investigated after using X‐ray photoelectron spectroscopy.