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High Melting Pb‐Free Solder Alloys for Die‐Attach Applications
Author(s) -
Rettenmayr M.,
Lambracht P.,
Kempf B.,
Graff M.
Publication year - 2005
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200500124
Subject(s) - soldering , materials science , metallurgy , wetting , microstructure , thermal conductivity , melting point , atmospheric temperature range , elongation , die (integrated circuit) , composite material , ultimate tensile strength , nanotechnology , physics , meteorology
Bi‐Ag alloys with Ag contents of up to 12 wt.% Ag are potential substitutes for Pb‐containing alloys in the high temperature range (T > 260 °C) of soft solders. Bi solders were produced in form of wires and can therefore be used in the same kind of soldering equipment as conventional Pb‐rich solder wires. Bi‐Ag alloys were characterized in terms of melting range and microstructure, mechanical properties (yield strength and elongation to fracture), wetting behavior, thermal fatigue behavior and thermal conductivity. The thermal conductivity is lower than that of the conventional Pb‐containing solder alloys, but all other properties tested are comparable or superior to those of Pb‐rich conventional solder alloys. It thus appears to be possible to use Bi‐Ag alloys as ‘drop‐in‐replacement' for Pb‐rich alloys.