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Micromachining by Focused Ion Beam (FIB) for Materials Characterization
Author(s) -
Jud P. P.,
Nellen P. M.,
Sennhauser U.
Publication year - 2005
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200500048
Subject(s) - materials science , focused ion beam , characterization (materials science) , surface micromachining , ion beam , creep , nanometre , nanotechnology , ion milling machine , soldering , composite material , beam (structure) , ion , optics , fabrication , layer (electronics) , medicine , physics , alternative medicine , pathology , quantum mechanics
Surface patterning was investigated first to analyze the creep behavior of lead‐free solder and second to optimize FIB milling parameters. It was found that surface patterning, consisting of thin ion etched lines and dots, is a useful method to quantify local deformation. Concerning the milling parameters redeposition was found to be a crucial point for the FIB micro‐ and nanometer 3D structuring.