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Grain Size Effects on the Mechanical Behavior of Open‐cell Nickel Foams
Author(s) -
Goussery V.,
Bienvenu Y.,
Forest S.,
Gourgues A.F.,
Colin C.,
Bartout J.D.
Publication year - 2004
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200405153
Subject(s) - materials science , grain size , nickel , composite material , grain boundary strengthening , grain growth , hardening (computing) , modulus , electron backscatter diffraction , cell size , strengthening mechanisms of materials , grain boundary , metallurgy , microstructure , layer (electronics) , biology , microbiology and biotechnology
The dependence of the mechanical behavior of nickel foams upon their grain size was studied. First, the grain coarsening phenomenon which occurs during the processing of foams was analyzed. A metallurgical characterization of the grain growth during heat treatment was performed. The grain size effects on the mechanical properties was then studied, namely, via the Hall‐Petch law. The foam walls being very thin, roughly 10 μm in thickness, grain growth and mechanical behavior might be different compared with conventional materials. The present results obtained with foams were compared with literature data on bulk pure nickel and with nickel foils of 10 and 50 μm in thickness which are good candidates for the modeling of the cell walls. The EBSD technique allowed observing the absence of preferred crystallographic orientations for both foams and foils. A mechanical model in the spirit of that by Gibson and Ashby was finally presented incorporating the grain size effect on yield strength and hardening modulus. This model provided a good estimation of the experimental data.