Premium
Size and Constraining Effects in Lead‐Free Solder Joints
Author(s) -
Cugi J.,
Botsis J.,
JanczakRusch J.
Publication year - 2006
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200400236
Subject(s) - soldering , materials science , digital image correlation , lead (geology) , constitutive equation , metallurgy , strain (injury) , stress (linguistics) , composite material , characterization (materials science) , structural engineering , finite element method , nanotechnology , medicine , engineering , geology , linguistics , philosophy , geomorphology
A novel in‐situ characterization technique combining Digital Image Correlation strain measurement and inverse numerical identification was developed to determine the plastic constitutive properties of Sn‐Ag‐Cu lead‐free soldering material inside real joints. The effects of size and geometrical constraints on the constitutive and apparent stress‐strain response of 0.1, 0.5 and 1mm joints were studied, showing clearly the important constraining and size effects in thin solder joints.