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Processing and Characterization of Al‐Cu and Al‐Mg Base Composites Reinforced with TiC
Author(s) -
Contreras A.,
Albiter A.,
Bedolla E.,
Pérez R.
Publication year - 2004
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200400102
Subject(s) - materials science , composite material , transmission electron microscopy , metal , characterization (materials science) , electrical resistivity and conductivity , microstructure , aluminium , metallurgy , nanotechnology , engineering , electrical engineering
Most of the work on metal matrix composites (MMCs) is based in Al and its alloys, because of its high electrical conductivity, heat treatment capability and low density. The current study presents the infiltration behavior of liquid Al‐Cu and Al‐Mg alloys into TiC preforms. Some mechanical and microstructural properties of the infiltrated composites are also presented, in addition to transmission electron microscopy studies (TEM).