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X‐ray Diffraction Studies of Free‐Standing Electrodeposited Cu‐patterns
Author(s) -
Pantleon K.,
Jensen H.M.,
Somers M.A.J.
Publication year - 2004
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200400089
Subject(s) - diffraction , materials science , x ray crystallography , texture (cosmology) , line (geometry) , crystallography , range (aeronautics) , optics , composite material , geometry , image (mathematics) , chemistry , physics , mathematics , artificial intelligence , computer science
Free‐standing Cu‐line patterns with various line widths and interline distances in the range of a few micrometers were electrodeposited. X‐ray diffraction (XRD) was applied for quantification of crystallographic texture and XRD‐peak broadening studies in dependence on the Cu‐line dimensions. Supplementary to XRD, finite element modeling of the strain distribution within individual Cu‐lines was carried out.