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Micron‐scale Deformation and Damage Mechanisms of Ti 3 SiC 2 Crystals Induced by Indentation
Author(s) -
Zhang Z.F.,
Sun Z.M.,
Zhang H.,
Hashimoto H.
Publication year - 2004
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200400071
Subject(s) - indentation , materials science , composite material , deformation (meteorology) , vickers hardness test , indentation hardness , cleavage (geology) , deformation mechanism , nanometre , delamination (geology) , fracture (geology) , microstructure , paleontology , biology , subduction , tectonics
Vickers hardness, deformation and damage mechanisms of Ti 3 SiC 2 crystals induced by indentation in the load range of 0.25 – 20 N were investigated. The Vickers hardness of Ti 3 SiC 2 crystals decreases with increasing indentation load and finally reaches a constant value of ∼ 4 GPa. The typical deformation and damage modes in Ti 3 SiC 2 crystals include: sliding, buckling, kinking, delamination and cleavage fracture of deformation bands as well as intergranular cracking. A deformation and damage mechanism map for Ti 3 SiC 2 crystals was summarized.