Micron‐scale Deformation and Damage Mechanisms of Ti 3 SiC 2  Crystals Induced by Indentation | Zendy

Zhang Z.F. | Zendy; Sun Z.M. | Zendy; Zhang H. | Zendy; Hashimoto H. | Zendy

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Micron‐scale Deformation and Damage Mechanisms of Ti 3 SiC 2 Crystals Induced by Indentation

Author(s) -

Zhang Z.F.,

Sun Z.M.,

Zhang H.,

Hashimoto H.

Publication year - 2004

Publication title -

advanced engineering materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.938

H-Index - 114

eISSN - 1527-2648

pISSN - 1438-1656

DOI - 10.1002/adem.200400071

Subject(s) - indentation , materials science , composite material , deformation (meteorology) , vickers hardness test , indentation hardness , cleavage (geology) , deformation mechanism , nanometre , delamination (geology) , fracture (geology) , microstructure , paleontology , biology , subduction , tectonics

Vickers hardness, deformation and damage mechanisms of Ti 3 SiC 2 crystals induced by indentation in the load range of 0.25 – 20 N were investigated. The Vickers hardness of Ti 3 SiC 2 crystals decreases with increasing indentation load and finally reaches a constant value of ∼ 4 GPa. The typical deformation and damage modes in Ti 3 SiC 2 crystals include: sliding, buckling, kinking, delamination and cleavage fracture of deformation bands as well as intergranular cracking. A deformation and damage mechanism map for Ti 3 SiC 2 crystals was summarized.

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