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How High‐Pressure Die‐Cast Component (HPDC) Foundries Benefit from Numerical Simulation
Author(s) -
Pellikka E.A.,
Wendt J.
Publication year - 2003
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200390009
Subject(s) - die (integrated circuit) , die casting , component (thermodynamics) , process (computing) , materials science , mechanical engineering , manufacturing engineering , high pressure , electronics , engineering , metallurgy , computer science , engineering physics , electrical engineering , thermodynamics , physics , operating system
The value of simulating the high pressure die‐casting process is demonstrated by showing and discussing the abilities of state‐of‐the‐art modeling of a typical component of the electronics industry. Process parameters, which can be optimized by simulation as well as process improvements, are identified. An evaluation of HPDC‐modeling in terms of process improvement, quality, and efforts is carried out and prospects for future developments are given.