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Thermophysical Properties Benchmark Tests on a Monocrystalline Ni‐base Alloy
Author(s) -
Hermann W.,
Neuer G.,
Leitner G.,
Poeßnecker W.,
Quested P.,
Richter F.,
Sockel H.G.
Publication year - 2003
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200390006
Subject(s) - materials science , thermal diffusivity , monocrystalline silicon , thermal conductivity , alloy , heat capacity , benchmark (surveying) , base (topology) , thermodynamics , measure (data warehouse) , thermal , specific heat , metallurgy , composite material , silicon , physics , mathematical analysis , mathematics , geodesy , database , computer science , geography
Benchmark tests for measuring thermophysical properties of monocrystalline Ni‐base alloys have been conducted. Samples of the same batch of alloys were tested in six different laboratories using a variety of techniques to measure e.g., density, linear thermal expansion, specific heat capacity, thermal diffusivity, and thermal conductivity as a function of temperature. The results of these direct measurements and the derived properties are compared and discussed.