Scanning Kelvin Probe Measurements of the Stability of Adhesive/Metal Interfaces in Corrosive Environments | Zendy

Wapner K. | Zendy; Grundmeier G. | Zendy

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Scanning Kelvin Probe Measurements of the Stability of Adhesive/Metal Interfaces in Corrosive Environments

Author(s) -

Wapner K.,

Grundmeier G.

Publication year - 2004

Publication title -

advanced engineering materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.938

H-Index - 114

eISSN - 1527-2648

pISSN - 1438-1656

DOI - 10.1002/adem.200300579

Subject(s) - materials science , kelvin probe force microscope , aluminium , adhesion , adhesive , bilayer , corrosion , metal , composite material , metallurgy , nanotechnology , layer (electronics) , atomic force microscopy , membrane , chemistry , biochemistry

The strength of structural adhesive joints for the bonding of metals such as steel or aluminium is mainly reduced by the degradation of the polymer/metal interface due to the ingression of water and subsequent electrochemical reactions. In this work, adhesive/metal interfaces were modified with ultra‐thin adhesion promoting and corrosion resistant bilayer films. A Scanning Kelvin Probe was used for the in‐situ measurement of the interfacial ingression of water and ions as well as for the characterisation of electron transfer processes that lead to a corrosive de‐adhesion.

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