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Characterisation and Optimisation of Innovative Solders for Transient Liquid Phase Bonding and Active Soldering
Author(s) -
Lugscheider E.,
Ferrara S.
Publication year - 2004
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200300538
Subject(s) - soldering , materials science , microsystem , microstructure , transient (computer programming) , ceramic , phase (matter) , liquid phase , liquid metal , metallurgy , mechanical engineering , composite material , nanotechnology , computer science , engineering , physics , organic chemistry , thermodynamics , chemistry , operating system
Hybrid microstructures, able to combine the different properties of metallic and ceramic materials, are a source of growing interest in the field of microsystem engineering. Besides the construction technique, the joining technique plays a crucial role within this framework. Two innovative bonding technologies have been investigated: Transient Liquid Phase (TLP) Bonding and Active Soldering. New solders have been developed, evaluated and characterized with regard to fundamental parameters for the microstructures.