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Influence of Annealing on the Residual Stress in Sputter‐Deposited Platinum Films
Author(s) -
Härting M.,
Ntsoane T.P.,
Bucher R.
Publication year - 2002
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/1527-2648(20020806)4:8<607::aid-adem607>3.0.co;2-e
Subject(s) - residual stress , materials science , platinum , annealing (glass) , sputtering , stress (linguistics) , composite material , metallurgy , thermal , thin film , nanotechnology , thermodynamics , biochemistry , chemistry , linguistics , philosophy , catalysis , physics
The changes of residual stress in commercially produced platinum layers during heat treatment are studies in this paper. X‐ray stress determination techniques yield, superimposed, both the thermal and intrinsic stresses in the layer. An analytical model, following the method of Tsui and Clyne, is used to separate these two stress contributions. This allows one to interpret the development of the intrinsic stress under thermal influence.