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Residual Stress in Copper Containing a High Concentration of Krypton Precipitates
Author(s) -
Härting M.,
Yaman M.,
Bucher R.,
Britton D.T.
Publication year - 2002
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/1527-2648(20020806)4:8<592::aid-adem592>3.0.co;2-2
Subject(s) - materials science , krypton , residual stress , copper , shear stress , stress (linguistics) , bubble , diffraction , matrix (chemical analysis) , critical resolved shear stress , metallurgy , composite material , crystallography , mechanics , chemistry , argon , shear rate , rheology , linguistics , philosophy , physics , organic chemistry , optics
A study of the residual stress and bubble pressure in bulk samples of copper, containing 3 at.‐% krypton, using X‐ray diffraction techniques is presented here. The authors have confirmed that the Kr forms solid precipitates with an fcc structure, which is consistent with an estimated pressure of 2.4 GPa. Stress measurements in the surrounding Cu matrix indicate a zero normal stress, confirming that the matrix experiences only a shear strain. The magnitude of the shear stress is estimated from the bubble pressure to be below the yield stress of the matrix, thus explaining the long term stability of the bubbles.