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An XPS study of copper corrosion originated by formic acid vapour at 40% and 80% relative humidity
Author(s) -
Cano E.,
Torres C. L.,
Bastidas J. M.
Publication year - 2001
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/1521-4176(200109)52:9<667::aid-maco667>3.0.co;2-h
Subject(s) - chemistry , formic acid , x ray photoelectron spectroscopy , copper , formate , nuclear chemistry , relative humidity , hydroxide , inorganic chemistry , organic chemistry , catalysis , physics , nuclear magnetic resonance , thermodynamics
Copper corrosion products originated by the action of formic acid vapours at 40% and 80% relative humidity for a period of 21 days were analysed. Three formic vapour concentration levels (10, 100 and 300 ppm) were generated in laboratory tests at 30°C. The corrosion product layers were characterised using X‐ray photoelectron spectroscopy (XPS) in conjunction with Ar + ‐ion sputtering. The components identified in the patina layers were cuprite (Cu 2 O), copper hydroxide (Cu(OH) 2 ) and copper formate (Cu(HCOO) 2 ). Copper formate was formed by a complex mechanism including copper hydroxide and formic acid.