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Evaluation of corrosion behaviour of a new class of Pb‐free solder materials (Sn‐In‐Zn)
Author(s) -
Sabbar A.,
AlaouiEl Belghiti M.,
Zrineh A.,
El Hajjaji S.,
Bachir A. Ben
Publication year - 2001
Publication title -
materials and corrosion
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 55
eISSN - 1521-4176
pISSN - 0947-5117
DOI - 10.1002/1521-4176(200104)52:4<298::aid-maco298>3.0.co;2-0
Subject(s) - metallurgy , corrosion , zinc , materials science , electrochemistry , ternary operation , eutectic system , melting point , chemistry , nuclear chemistry , dissolution , soldering , microstructure , composite material , electrode , computer science , programming language
In view of the need for a lead‐free drop in replacement for the widely used 40Pb‐60Sn near eutectic solder, new Sn‐In‐Zn based alloys with substantially the same melting point have been developed. The corrosion resistance and the influence of zinc content on electrochemical behaviour of some special alloys Sn‐In‐Zn in 3% NaCl solution has been investigated using electrochemical techniques. The good resistance of this ternary system is confirmed. In decreasing dissolution rate, they are ranked as follows: 40Pb‐60Sn, Sn‐10.6In‐27Zn, Sn‐11In‐23Zn and Sn‐13In‐12Zn. The increase of zinc content induces a decrease of corrosion resistance of ternary Sn‐In‐Zn alloys. So, the Sn‐In‐Zn system with low indium and zinc concentrations might be a good candidate for solder materials and present a good corrosion resistance.