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The Potential Use of Low‐Grade Phosphate Rocks as Adsorbent
Author(s) -
Kandah M. I.
Publication year - 2002
Publication title -
chemical engineering and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.403
H-Index - 81
eISSN - 1521-4125
pISSN - 0930-7516
DOI - 10.1002/1521-4125(20020910)25:9<921::aid-ceat921>3.0.co;2-g
Subject(s) - tartaric acid , citric acid , chemistry , aqueous solution , adsorption , phosphate , ethylene diamine , inorganic chemistry , copper , nuclear chemistry , acetic acid , sodium , ligand (biochemistry) , chloride , organic chemistry , biochemistry , receptor
This study evaluates the suitability of using low‐grade phosphate for Cu 2+ removal. The study also investigates the effects of the presence of ethylene‐diamine‐tetra‐acetic acid (EDTA), citric acid, tartaric acid and sodium chloride in a solution containing Cu 2+ on the adsorption capacity of Cu 2+ onto low‐grade phosphate. For aqueous solutions with 100 ppm Cu 2+ , the percentage removal of Cu 2+ at pH 4 onto 0.2 g of 0.063 mm low‐grade phosphate was found to be 96.6 % after one hour. Using one mmol of either Cu 2+ , Cu‐NaCl, Cu‐tartaric acid, Cu‐EDTA, or Cu‐citric acid aqueous solutions, the present work shows trend of the percentage removal of Cu 2+ at equilibrium time: Cu 2+ > Cu‐NaCl > Cu‐tartaric acid > Cu‐EDTA > Cu‐citric acid. It is also found that increasing the concentration of ligand to copper ratio decreases the percentage removal of Cu 2+ significantly. This means that the adsorption capacity is ligand type and concentration dependent.