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Electrochemical Behavior of Silver‐Copper Alloys in Voltammetry of Microparticles: A Simple Method for Screening Purposes
Author(s) -
Cepriá Gemma,
Abadías Olga,
PérezArantegui Josefina,
Castillo Juan R.
Publication year - 2001
Publication title -
electroanalysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.574
H-Index - 128
eISSN - 1521-4109
pISSN - 1040-0397
DOI - 10.1002/1521-4109(200104)13:6<477::aid-elan477>3.0.co;2-e
Subject(s) - oxalic acid , cyclic voltammetry , copper , electrochemistry , voltammetry , scanning electron microscope , materials science , thiocyanate , graphite , ammonia , electrode , analytical chemistry (journal) , inorganic chemistry , chemistry , metallurgy , chromatography , composite material , organic chemistry
Voltammetry of microparticles (VMP) is used as a tool to identify Ag/Cu alloys. The identification process is based on the position of the voltammetric peaks obtained in different media: ammonia buffer 0.1 M, oxalic acid 0.4 M and thiocyanate 0.4 M, for samples of Ag, Cu and Ag/Cu alloys, immobilized on a graphite electrode. The phases and structure of four Ag/Cu alloys (91 : 9, 70 : 30, 40 : 60, 10 : 90) were studied by scanning electron microscopy (SEM) and then related to the voltammograms to establish a relationship between structure and peak shape and position.