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Self‐Assembled Nanowire Networks by Deposition of Copper onto Layered‐Crystal Surfaces
Author(s) -
Adelung R.,
Ernst F.,
Scott A.,
TabibAzar M.,
Kipp L.,
Skibowski M.,
Hollensteiner S.,
Spiecker E.,
Jäger W.,
Gunst S.,
Klein A.,
Jägermann W.,
Zaporojtchenko V.,
Faupel F.
Publication year - 2002
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/1521-4095(20020805)14:15<1056::aid-adma1056>3.0.co;2-f
Subject(s) - materials science , nanowire , copper , deposition (geology) , nanotechnology , evaporation , vacuum evaporation , vacuum deposition , crystal (programming language) , enhanced data rates for gsm evolution , layer (electronics) , thin film , metallurgy , paleontology , sediment , biology , telecommunications , physics , computer science , programming language , thermodynamics
Self‐assembled copper nanowire networks on layered‐crystal surfaces are reported. Obtained from a simple thermal evaporation process in ultra high vacuum, they possess high mechanical strength and a significant elevation over a usually step‐edge free surface. These features render Cu‐induced nanowire networks particularly accessible to various techniques of microcharacterization such as AFM (see Figure).