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Morphology and Thermal Stability of Metal Contacts on Crystalline Organic Thin Films
Author(s) -
Dürr A.C.,
Schreiber F.,
Kelsch M.,
Carstanjen H.D.,
Dosch H.
Publication year - 2002
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/1521-4095(20020705)14:13/14<961::aid-adma961>3.0.co;2-x
Subject(s) - materials science , metal , layer (electronics) , thermal stability , morphology (biology) , thin film , nanotechnology , deposition (geology) , diffusion , chemical engineering , metallurgy , paleontology , physics , sediment , biology , engineering , genetics , thermodynamics
The interfacial properties of metal contacts on organic substrates are strongly determined by the preparation conditions of the gold film. A gold–diindenoperylene (DIP) interface has been studied as a model system for metal contacts on organic electronic devices. The Figure juxtaposes the two deposition methods used, whereby only the first method leads to a well‐defined interface with only a slight amount of diffusion of the gold film into the DIP layer.