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Pure Silica Zeolite Films as Low‐ k Dielectrics by Spin‐On of Nanoparticle Suspensions
Author(s) -
Wang Z. B.,
Mitra A.,
Wang H. T.,
Huang L. M.,
Yan Y.
Publication year - 2001
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/1521-4095(200110)13:19<1463::aid-adma1463>3.0.co;2-h
Subject(s) - materials science , zeolite , dielectric , nanoparticle , nanotechnology , chemical engineering , spin (aerodynamics) , organic chemistry , optoelectronics , catalysis , mechanical engineering , chemistry , engineering
The preparation of ultra low‐ k zeolite films with high mechanical strength by a simple spin‐on process is demonstrated. Continuous, smooth, thin zeolite silicalite films with a dielectric constant of 2.1 and elastic modulus of 16–18 GPa are obtained by this process, which is simple and compatible with the requirements of the semiconductor manufacturers. Polishing experiments showed that the film is potentially compatible with chemical mechanical polishing (CMP). The described pure silica film could be an attractive candidate for ultra‐low‐ k materials for future generation microprocessors.