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Spin‐on Mesoporous Silica Films with Ultralow Dielectric Constants, Ordered Pore Structures, and Hydrophobic Surfaces
Author(s) -
Yang C. M.,
Cho A. T.,
Pan F. M.,
Tsai T. G.,
Chao K. J.
Publication year - 2001
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/1521-4095(200107)13:14<1099::aid-adma1099>3.0.co;2-0
Subject(s) - materials science , dielectric , mesoporous silica , spin coating , mesoporous material , thermal stability , semiconductor , coating , nanotechnology , chemical engineering , spin (aerodynamics) , composite material , optoelectronics , organic chemistry , chemistry , aerospace engineering , engineering , catalysis
Smooth mesoporous silica films (see Figure) can now be obtained with very low dielectric constants by spin coating, whereby the thickness and hydrophobicity of the films can also be controlled. This is thanks to a functionalized precursor as is unveiled in this communication. These films are sure to be on the wanted list for semiconductor applications as they combine dielectric stability with a low processing temperature, an excellent thermal stability, and reliable mechanical properties.