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Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub‐100 nm Lithography
Author(s) -
Tully D. C.,
Trimble A. R.,
Fréchet J. M. J.
Publication year - 2000
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/1521-4095(200008)12:15<1118::aid-adma1118>3.0.co;2-i
Subject(s) - resist , dendrimer , materials science , lithography , polymer , nanotechnology , polymer chemistry , optoelectronics , composite material , layer (electronics)
Chemically amplified resists based on dendritic polymer resins are investigated by these authors. The synthesis of the dendrimers, which are based on the polyfunctional core shown in the Figure, is described and properties such as T decomp and T g are examined. Resist formulations prepared from these dendrimers are shown to be highly sensitive to both deep UV and e‐beam exposure, allowing reproducible patterning well below 100 nm.