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Chemical Fluid Deposition: A Hybrid Technique for Low‐Temperature Metallization
Author(s) -
Long D. P.,
Blackburn J. M.,
Watkins J. J.
Publication year - 2000
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/1521-4095(200006)12:12<913::aid-adma913>3.0.co;2-#
Subject(s) - materials science , deposition (geology) , nanotechnology , chemical vapor deposition , chemical engineering , paleontology , sediment , engineering , biology
Chemical fluid deposition (CFD) is a novel approach to metal deposition that involves the chemical reduction of organometallic compounds in supercritical carbon dioxide to yield high purity films at low temperature. Since supercritical CO 2 can exhibit densities that approach those of a liquid solvent while retaining the transport properties of a gas, CFD is essentially a hybrid technique that uniquely blends the advantages of chemical vapor deposition (CVD) and electroless plating. Here, we describe the deposition of high‐purity films of Pt, Pd, Au, and Rh onto inorganic and polymer substrates by the reduction of appropriate precursors in CO 2 at 60 °C.