Premium
Calculation of Impurity Release from Walls and its Transport in Edge Plasmas
Author(s) -
Kawakami R.,
Ohya K.,
Kawata J.
Publication year - 2000
Publication title -
contributions to plasma physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.531
H-Index - 47
eISSN - 1521-3986
pISSN - 0863-1042
DOI - 10.1002/1521-3986(200006)40:3/4<519::aid-ctpp519>3.0.co;2-i
Subject(s) - impurity , materials science , deposition (geology) , sputtering , plasma , ionization , atomic physics , ion , yield (engineering) , analytical chemistry (journal) , thin film , nanotechnology , chemistry , metallurgy , physics , paleontology , organic chemistry , chromatography , quantum mechanics , sediment , biology
Computer simulation by the plasma‐solid interaction code EDDY has been performed in order to investigate the erosion and impurity redeposition processes of both W and C materials under the mutual contamination, i.e., C deposition on W and W deposition on C. In the code, dynamic surface composition change during on bombardment, ionization of released atoms in the plasma, and gyromotion of the ionized atoms in a magnetic field are included. The redeposition of sputtered atoms causes substantially lower effective sputtering yield and lower erosion rate of a W surface, and a decrease in low‐energy component of the atoms finally penetrating into a core plasma. W impurities are deposited on a C surface due to the redeposition, whereas C impurities deposited on the W surface are sputtered by impact of most constituent D ions. The W (C) deposition on the C (W) surface substantially increases (slightly decreases) the reflection coefficient for D and impurity ions.