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Nanohardness of a Ti Thin Film and Its Interface Deposited by an Electron Beam on a 304 SS Substrate
Author(s) -
Vieira R.A.,
o M.C.A.,
Cruz N.C.
Publication year - 2002
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/1521-3951(200207)232:1<116::aid-pssb116>3.0.co;2-1
Subject(s) - nanoindentation , materials science , substrate (aquarium) , layer (electronics) , thin film , composite material , scanning electron microscope , diffusion , nanotechnology , oceanography , geology , physics , thermodynamics
The results of nanohardness measurements at a film surface and film–substrate interface are presented and discussed. An electron beam device was used to deposit a Ti film on a 304 stainless steel (304 SS) substrate. The diluted interface was obtained by thermal activated atomic diffusion. The Ti film and Ti film–304 SS interface were analyzed by energy dispersive spectrometry and were observed using atomic force microscopy. The nanohardness of the Ti film–304 SS system was measured by a nanoindentation technique. The results showed the Ti film–304 SS interface had a higher hardness value than the Ti film and 304 SS substrate. The Ti film surface had a lower hardness due to the presence of a TiO 2 thin layer.