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Thermal stress analysis for polyimide thin film and a substrate layer system
Author(s) -
Lee Sang Hun,
Bae Young Chan
Publication year - 2000
Publication title -
macromolecular chemistry and physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.57
H-Index - 112
eISSN - 1521-3935
pISSN - 1022-1352
DOI - 10.1002/1521-3935(20000801)201:12<1286::aid-macp1286>3.0.co;2-k
Subject(s) - polyimide , materials science , isobaric process , layer (electronics) , stress (linguistics) , substrate (aquarium) , thermal , evaporation , polymer , thin film , composite material , thermodynamics , nanotechnology , physics , linguistics , philosophy , oceanography , geology
We propose an analytical model based on Timoshenko's theory which describes chemical and physical properties of a polymer and a substrate layer system. This temperature dependent model is developed to account for the thermal stress caused by a mismatch of isobaric expansivity, due to the solvent evaporation and imidization. The stress‐temperature profiles calculated from the proposed model are compared with experimental data for the given systems. The model gives a qualitative information for the stress development during the heating‐cooling process.