Further Study of Sub‐ T  g  Heat Flow Transition of a Cured Epoxy Resin | Zendy

Chen Xiangxu | Zendy; Li Shanjun | Zendy

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Further Study of Sub‐ T g Heat Flow Transition of a Cured Epoxy Resin

Author(s) -

Chen Xiangxu,

Li Shanjun

Publication year - 2001

Publication title -

macromolecular rapid communications

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.348

H-Index - 154

eISSN - 1521-3927

pISSN - 1022-1336

DOI - 10.1002/1521-3927(20010301)22:5<349::aid-marc349>3.0.co;2-x

Subject(s) - epoxy , glass transition , materials science , torsion pendulum clock , composite material , heat flow , polymer chemistry , thermal analysis , thermal , thermodynamics , polymer , physics , quantum mechanics

To further study the sub‐ T g heat flow transition of a cured epoxy resin, cured samples with different thermal history were investigated using torsion pendulum analysis (TPA) and thermal mechanical analysis (TMA). The results indicate that sub‐ T g heat flow transition could be related to the molecular relaxation from 20°C to the α‐peak, and that frozen‐in extra free volume is necessary for the appearance of sub‐ T g heat flow transition.

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