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Thermal stress analysis for polyimide thin film: The effect of solvent evaporation
Author(s) -
Lee Sang Hun,
Bae Young Chan
Publication year - 2000
Publication title -
macromolecular theory and simulations
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.37
H-Index - 56
eISSN - 1521-3919
pISSN - 1022-1344
DOI - 10.1002/1521-3919(20000601)9:5<281::aid-mats281>3.0.co;2-f
Subject(s) - solvent , evaporation , polyimide , isobaric process , materials science , stress (linguistics) , thermal , thermodynamics , viscosity , composite material , polymer chemistry , chemistry , organic chemistry , physics , layer (electronics) , linguistics , philosophy
We propose a stress model to account for the thermal stress caused by a mismatch of isobaric expansivity, solvent evaporation, and imidization. The evaporation strain term is given as functions of a viscosity, and solvent weight fraction. The proposed model is in very good agreement with experimental data and gives useful information about the analysis of the thermal stress caused in polymeric films.