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Organic imaging materials: a view of the future
Author(s) -
Stewart Michael D.,
Patterson Kyle,
Somervell Mark H.,
Willson C. Grant
Publication year - 2000
Publication title -
journal of physical organic chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.325
H-Index - 66
eISSN - 1099-1395
pISSN - 0894-3230
DOI - 10.1002/1099-1395(200012)13:12<767::aid-poc323>3.0.co;2-a
Subject(s) - photoresist , photolithography , semiconductor industry , nanotechnology , chemistry , engineering physics , process engineering , manufacturing engineering , engineering , materials science , layer (electronics)
Over the last half century, the world semiconductor industry has provided phenomenal increases in computing power while simultaneously lowering production costs. This achievement is largely the result of the industry being able to print smaller and smaller features using photolithographic techniques. The organic imaging materials used in the photolithography (generally known as photoresists) have undergone many changes over the industry's history, and if the increases in computing speeds and decreases in costs are to continue in the future, more changes are necessary. This paper discusses the current generation of photoresists and the on‐going development of future generation photoresist technologies. Copyright © 2000 John Wiley & Sons, Ltd.