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High‐performance flip‐chip technique with an optimized coplanar waveguide
Author(s) -
Iwasaki Noboru,
Ishitsuka Fuminori,
Tsunetsugu Hideki,
Kato Kazutoshi
Publication year - 2000
Publication title -
international journal of rf and microwave computer‐aided engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.335
H-Index - 39
eISSN - 1099-047X
pISSN - 1096-4290
DOI - 10.1002/1099-047x(200009)10:5<289::aid-mmce4>3.0.co;2-v
Subject(s) - coplanar waveguide , flip chip , extremely high frequency , bandwidth (computing) , capacitance , chip , microwave , return loss , electronic engineering , millimeter , materials science , optoelectronics , computer science , electrical engineering , engineering , physics , telecommunications , optics , electrode , adhesive , layer (electronics) , quantum mechanics , antenna (radio) , composite material
A new design technique for flip‐chip structures with an optimized coplanar waveguide (CPW) is proposed. One of the features of this technique is that wide‐gap CPW patterns are formed to reduce the excessive capacitance between the two signal lines in the flip‐chip structure. Thus, it is possible to achieve a return loss in excess of 28 dB up to 58 GHz. Another feature is that the design method is improved by using two‐dimensional (2D) cross‐sectional analysis to optimize the parameters of the flip‐chip structure. The design turn‐around time is at least one‐third that of the method using only three‐dimensional (3D) electromagnetic field analysis. By applying our method to the design of a wide‐band photoreceiver, we estimated a 3‐dB down bandwidth up to 60 GHz. These results show that our proposed techniques are useful for millimeter‐wave or wide‐band communication systems. © 2000 John Wiley & Sons, Inc. Int J RF and Microwave CAE 10: 289–295, 2000.