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Fracture behavior of glass bead filled epoxies: Cleaning process of glass beads
Author(s) -
Lee Jonghwi,
Yee Albert F.
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/1097-4628(20010222)79:8<1371::aid-app40>3.0.co;2-o
Subject(s) - bead , materials science , composite material , thermosetting polymer , epoxy , distilled water , ultimate tensile strength , polymer , glass fiber , chemistry , chromatography
Inorganic particles are commonly cleaned with solvents such as alcohols before being incorporated into thermoset polymers as fillers or tougheners, but the role of the cleaning process has never been examined. In this study, the effect of the cleaning process on the fracture behavior of particulate composites is investigated using glass bead filled epoxies as model systems. The cleaning process is shown to be a simple method to strengthen the interface between the glass beads and the epoxy matrix. Although the chemistry of the glass bead surface is unlikely to be altered by the cleaning process, submicron particles that exist on the glass bead surfaces are removed by cleaning with distilled water or ultrasonic vibration. The removal of submicron particles increases the interfacial strength between the glass beads and the matrix and changes the tensile strength of the composites. However, the modulus and fracture toughness of the composites is not significantly dependent on the cleaning process. Thus, it may be the case that debonding of the glass beads is not one of the major energy dissipating mechanisms in the fracture of glass bead filled thermoset systems. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 1371–1383, 2001