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A novel preparation of polyimide/clay hybrid films with low coefficient of thermal expansion
Author(s) -
Gu Aijuan,
Chang FengChih
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/1097-4628(20010110)79:2<289::aid-app100>3.0.co;2-v
Subject(s) - polyimide , thermal expansion , tetrahydrofuran , materials science , thermal stability , dispersion (optics) , polymer chemistry , polymer , dimethylacetamide , nanocomposite , ultimate tensile strength , elongation , chemical engineering , chemistry , composite material , solvent , organic chemistry , physics , layer (electronics) , optics , engineering
A novel polyimide (PI)/clay hybrid nanocomposite, designated as PI (PAAS)/CM, has been developed from the poly(amic acid) salt of triethylamine and organomontmorillonite (CM) using a mixture solution of tetrahydrofuran (THF) and methanol (MeOH). For comparison, two other PI/clay hybrids derived from poly(amic acid) and CM in THF/MeOH solution and N,N ′‐dimethylacetamide (DMAc) solution, denoted as PI/CM (T/M) and PI/CM (DMAc), respectively, were also prepared. Dispersion of CM in polymer matrix, tensile properties, and thermal expansion properties of the three hybrids were investigated. Results show that PI (PAAS)/CM has the best dispersion of CM in polymer matrix, highest elongation, and lowest coefficient of thermal expansion values in all hybrids presented in this report. In addition, PI/CM (T/M) has better dispersion of CM and lower coefficient of thermal expansion value than PI/CM (DMAc). © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 289–294, 2001