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Synthesis and epoxy curing of Mannich bases derived from bisphenol A and poly(oxyalkylene)diamine
Author(s) -
Lin JiangJen,
Lin ShiauFeng,
Kuo TsoTing,
Chang FengChih,
Tseng FengPo
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/1097-4628(20001017)78:3<615::aid-app170>3.0.co;2-n
Subject(s) - diglycidyl ether , bisphenol a , epoxy , diamine , curing (chemistry) , differential scanning calorimetry , mannich reaction , glass transition , bisphenol , polymer chemistry , prepolymer , diethylenetriamine , phenol , formaldehyde , materials science , chemistry , polymer , organic chemistry , catalysis , polyurethane , physics , thermodynamics
A family of Mannich bases were prepared from the reaction of 2,2‐bis‐(4‐hydroxyphenyl)propane (bisphenol A or BPA), formaldehyde, and poly(oxyalkylene)diamines at 1 : 1 : 1 or 1 : 2 : 2 molar ratio. By varying the molar ratio of bisphenol A to amine and the chemical structures of poly(oxyalkylene)diamines, a series of products with multiple functionalities of primary/secondary amines, phenols, and poly(oxyalkylene) were prepared. The curing profiles of these products toward the diglycidyl ether of bisphenol A (DGEBA) were examined by a differential scanning calorimeter (DSC). The physical properties of these cured materials were correlated with the chemical structures of the Mannich bases. Compared with the poly(oxyalkylene)diamines, the built‐in phenol moiety in Mannich bases accelerated the curing rate. Both amine and phenol functionalities could be reactive sites toward diglycidyl ethers in a step‐wise fashion under catalytic (triphenylphosphine) and different temperature conditions. Furthermore, the cured polymers demonstrated improved properties including tensile and flexural strength in comparison with those cured by the corresponding poly(oxyalkylene)diamines. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 615–623, 2000