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Cure modeling and monitoring of epoxy/amine resin systems. II. Network formation and chemoviscosity modeling
Author(s) -
Karkanas Panagiotis I.,
Partridge Ivana K.
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/1097-4628(20000906)77:10<2178::aid-app11>3.0.co;2-0
Subject(s) - epoxy , rheometry , differential scanning calorimetry , glass transition , materials science , isothermal process , kinetics , viscosity , thermodynamics , polymer chemistry , calorimetry , composite material , polymer , physics , quantum mechanics
The glass transition temperature ( T g ) advancement and the chemoviscosity development under isothermal conditions have been investigated for four epoxy/amine systems, including commercial RTM6 and F934 resins. Differential scanning calorimetry (DSC) was the thermoanalytical technique used to determine the T g advancement and rheometry the technique for the determination of the chemoviscosity profiles of these resin systems. The complex cure kinetics were correlated to the T g advancement via an one‐to‐one relationship using Di Benedetto's formula. It was revealed that the three‐dimensional network formation follows a single activated mechanism independent of whether the cure kinetics follow a single or several activation mechanisms. The viscosity profiles showed the typical characteristics of epoxy/amine cure. A modified version of the Williams‐Landel‐Ferry equation (WLF) was adequate to model the viscosity profiles of all the resin systems, in the temperature range 130 to 170°C, with a very good degree of accuracy. The parameters of the WLF equation were found to vary in a systematic manner with cure temperature. Further correlation between T g and viscosity showed that gelation, defined as the point where viscosity reaches 10 4 Pas, occurs at a unique T g value for each resin system, which is independent of the cure conditions. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2178–2188, 2000