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Dielectric relaxation and mechanical properties of liquid crystalline epoxy thermosets
Author(s) -
Lu M. G.,
Shim M. J.,
Kim S. W.
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/1097-4628(20000815)77:7<1568::aid-app18>3.0.co;2-1
Subject(s) - epoxy , thermosetting polymer , dielectric , materials science , composite material , relaxation (psychology) , optoelectronics , psychology , social psychology
This article describes the dielectric relaxation behavior and mechanical properties of novel liquid crystalline (LC) epoxy thermosets. Thermal simulated current experiments show that there is an additional relaxation caused by the local orientation of mesogens. From the mechanical test, it is found that the LC thermoset exhibits higher tensile strength and even little more deformation. It shows that the cured networks can be strengthened by LC domain orientation. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 1568–1573, 2000