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A novel low‐melting‐point alloy‐loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology
Author(s) -
Zhang Xiangwu,
Pan Yi,
Shen Lie,
Zheng Qiang,
Yi Xiaosu
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/1097-4628(20000801)77:5<1044::aid-app11>3.0.co;2-d
Subject(s) - alloy , materials science , composite material , volume fraction , melting point , electrical resistivity and conductivity , composite number , hot pressing , dispersion (optics) , polystyrene , pressing , polymer , engineering , physics , optics , electrical engineering
Sn–Pb alloy‐loaded polystyrene (PS) composites were processed by powder mixing and hot pressing. For the composites hot‐pressed at the temperatures below the melting point of the alloy, the resistivity dropped sharply if the alloy volume fraction reached 20 vol %. When the composites were processed at temperatures above the melting point, such phenomenon disappeared. According to the SEM and energy dispersive analysis X‐ray (EDAX) analyses, the size and dispersion of Sn–Pb alloy particles in composites changed when the hot‐pressing temperature reached the melting point of the alloy, which resulted in the different forms of resistivity–filler volume fraction curves. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 1044–1050, 2000