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Nanostructured Thin Films of Organic–Organometallic Block Copolymers: One‐Step Lithography with Poly(ferrocenylsilanes) by Reactive Ion Etching
Author(s) -
Lammertink R. G. H.,
Hempenius M. A.,
van den Enk J. E.,
Chan V. Z.H.,
Thomas E. L.,
Vancso G. J.
Publication year - 2000
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/(sici)1521-4095(200001)12:2<98::aid-adma98>3.0.co;2-5
Subject(s) - materials science , nanoclusters , reactive ion etching , copolymer , lithography , thin film , etching (microfabrication) , nanotechnology , silicon , deposition (geology) , chemical engineering , optoelectronics , polymer , composite material , layer (electronics) , engineering , paleontology , sediment , biology
The deposition of thin films of inorganic nanoclusters as a route to one‐step lithography has been achieved using block copolymers with inherent inorganic (Fe and Si) components. Nanodomains of the organometallic part are resistant to removal during the subsequent O 2 etch, which results in well‐ordered and separate domains of iron and silicon oxides, as can be seen in the Figure.