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Lost Silicon Mold Process for PZT Microstructures
Author(s) -
Wang Shinan,
Li JingFeng,
Wakabayashi Katsuhiro,
Esashi Masayoshi,
Watanabe Ryuzo
Publication year - 1999
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/(sici)1521-4095(199907)11:10<873::aid-adma873>3.0.co;2-f
Subject(s) - materials science , actuator , lead zirconate titanate , ceramic , piezoelectricity , surface micromachining , microstructure , mold , voltage , silicon , layer (electronics) , composite material , sintering , electrode , optoelectronics , fabrication , ferroelectricity , dielectric , electrical engineering , medicine , chemistry , alternative medicine , pathology , engineering
Lead zirconate titanate (PZT) is an excellent piezoelectric actuator, however, its usefulness has been limited by its requirement for a high driving voltage. Here is described a novel silicon mold process that uses a combination of Si micromachining and ceramic sintering. The process yields many‐layer PZT structures (giving larger actuator forces) with very thin plates (allowing the actuator to be driven with a lower voltage), intercalated by Si electrodes. These ceramic microstructures possess finer feature sizes and higher aspect ratios.