Open AccessERRATUM: “Properties and reliability of liquid epoxy resin for LSI fabrication with the printing encapsulation system (PES)” volume 80, number 2, 1997, pages 67‐76
Author(s) -
Okuno Atsushi,
Fujita Noriko,
Nagai Koichiro,
Oyama Noritaka,
Hashimoto Tsunekazu
Publication year - 1997
Publication title -
electronics and communications in japan (part ii: electronics)
Language(s) - English
Resource type - Journals
eISSN - 1520-6432
pISSN - 8756-663X
DOI - 10.1002/(sici)1520-6432(199706)80:6<67::aid-ecjb9>3.0.co;2-1
Subject(s) - epoxy , encapsulation (networking) , materials science , fabrication , reliability (semiconductor) , volume (thermodynamics) , nanotechnology , composite material , computer science , physics , medicine , thermodynamics , computer network , power (physics) , alternative medicine , pathology
It has been brought to the attention of the publisher that an error appeared in the citation of the original Japanese publication of the above article. It should read as follows: Translated from Denshi Joho Tsushin Gakkai Ronbunshi Vol. 79‐C‐II, No. 8, August 1996, pp. 431–439. We apologize for any inconvenience this may have caused the authors.