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A highly reliable press packed IGBT
Author(s) -
Matsuda Hideo,
Kawamura Noriyasu,
Hiyoshi Michiaki,
Teramae Satoshi,
Nishitani Kazunobu
Publication year - 2000
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/(sici)1520-6416(20000415)131:1<78::aid-eej8>3.0.co;2-3
Subject(s) - insulated gate bipolar transistor , reliability (semiconductor) , materials science , diode , stress (linguistics) , bipolar junction transistor , voltage , temperature cycling , chip , transistor , electrical engineering , optoelectronics , engineering , thermal , power (physics) , linguistics , physics , philosophy , quantum mechanics , meteorology
Abstract A newly developed press packed reverse conducting IGBT (RCIGBT), the ST1000EX21, having ratings of 2500 V and 1000 A, has successfully been introduced in high‐reliability application areas. A multiple‐chip press packed RCIGBT structure, containing IGBT chips and fast recovery diode (FRD) chips, has been achieved by using basic experimental results and a stress analysis using the finite element structure analysis program ABAQUS. Excellent electrical characteristics, especially a robust turn‐off capability, such as I c = 5000 A, V cp = 2800 V at T j = 125 °C, have been obtained. High reliability, withstanding a thermal cycling (fatigue) test of more than 50,000 cycles and a high‐temperature voltage blocking test for 2000 hours, has been confirmed. The device is now available and is being successfully used for transportation systems and other applications that require high reliability and long‐term stability. Voltage and current ratings in IGBTs and IEGTs (Injection Enhanced Gate Transistors) will be raised in the future. © 2000 Scripta Technica, Electr Eng Jpn, 131(1): 78–85, 2000