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The effect of silane agent on tensile and bending properties of silica‐filled epoxy after water absorption by boiling
Author(s) -
Yoshida Yukio,
Higashihara Takashi,
Nomura Yukihiro,
Usui Eiji,
Hibi Sadao
Publication year - 1999
Publication title -
electrical engineering in japan
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.136
H-Index - 28
eISSN - 1520-6416
pISSN - 0424-7760
DOI - 10.1002/(sici)1520-6416(19991115)129:2<1::aid-eej1>3.0.co;2-u
Subject(s) - materials science , composite material , epoxy , boiling , absorption of water , ultimate tensile strength , composite number , adhesive , silane , bending , adhesion , particle (ecology) , natural rubber , composite epoxy material , chemistry , layer (electronics) , organic chemistry , oceanography , geology
The mechanical properties of tensile and bending deformations are explored for silica‐particle‐reinforced composite. The adhesive effects between epoxy resin and silica particles are expressed as the square root of boiling time in water. Mechanical properties are reduced by such boiling. Silane coupling agents contribute to adhesion between epoxy resin and silica particles in composite. The reinforcing effects of composite are analyzed by rubber–particle reinforcing model. © 1999 Scripta Technica, Electr Eng Jpn, 129(2): 1–12, 1999