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Infrared focal plane array storage life assessment by accelerated aging
Author(s) -
Asatourian Rolin K.
Publication year - 1998
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/(sici)1099-1638(199811/12)14:6<425::aid-qre226>3.0.co;2-j
Subject(s) - reliability (semiconductor) , reliability engineering , weibull distribution , accelerated aging , arrhenius equation , limiting , cardinal point , computer science , activation energy , materials science , engineering , optics , mechanical engineering , chemistry , mathematics , physics , statistics , power (physics) , organic chemistry , quantum mechanics
To satisfy the need for characterizing the aging process of infrared focal plane arrays (FPAs) in storage, tests were performed where FPAs were subjected to four different stress temperatures. A Weibull distribution which was fitted to the pixel failure data indicated a shape parameter of 0.97. An Arrhenius analysis showed that an activation energy of 0.76 eV is driving the aging process. Once such a device‐specific degradation was characterized, a lifetime was projected for the FPA. Secondly, it was determined that under certain conditions the FPA was expected to outlive the package it was in. The model developed offered a trade‐off tool to pass this ‘excess’ reliability of the FPA to a more life‐limiting component, namely the package, thus increasing the overall product reliability of the FPA–package combination. Thirdly, a relationship between reliability and cost was established which allowed grading the price of individual units based on their expected field reliability, before they leave the factory. Copyright © 1998 John Wiley & Sons, Ltd.